The biggest sputtering target factories in the world currently produce aluminum alloy sputtering targets using two separate processes. formed using spray molding.According to recognized casting and forging techniques, the addition of alloying materials during the production of aluminum alloy sputtering targets frequently results in segregation of the targets, which in turn lowers the quality of the sputtering films and Microparticles are likely to form on the surface of the sputtering target, which will also alter how uniformly the film's characteristics are distributed.
Although the linked problems listed above can be avoided, if the aluminum alloy sputtering target is manufactured using the known spray forming process, it will still produce the sputtering target. The cost of production is significantly raised, particularly when making some sputtering targets that are difficult to forge and require the use of hot equalization.
This technique uses gas spray powder to create aluminum alloy sputtering targets, which makes the production of titanium-aluminum alloy targets simpler and less expensive. The alloy powder is sieved in comparison to the sputtering target's raw material powder to get the right powder particle size, and then the powder is vacuum hot-pressed to create the aluminum alloy sputtering target.The creation of different aluminum alloy sputtering targets (aluminum-chromium, aluminum-silicon-copper, aluminum-titanium, etc.) can be accomplished using this method of producing aluminum alloy sputtering targets with air spray powder.
The recommended procedure for implementation is to first provide metal raw materials for manufacturing aluminum alloy sputtering targets and melt them into molten metal; next, make metal powders from the molten metal using the gas spray method; and finally, heat the metal powders using vacuum. formed into an aluminum alloy that will sputter and pass through an inert gas as a shielding gas.This process can produce high-quality sputtering targets more quickly and affordably while avoiding the drawbacks of material segregation and microparticles.
