Tantalum foil has a density of 16.6g/cm ³, indicating high density; The melting point is about 3017 ° C, and the high temperature resistance is extremely excellent; Low coefficient of thermal expansion, good dimensional stability under temperature changes; It also has good conductivity and thermal conductivity. Besides hydrofluoric acid and hot concentrated sulfuric acid, tantalum foil has strong resistance to other acids and chemical solvents, and can maintain stability in various chemical environments; At room temperature, a dense oxide film forms on the surface of tantalum foil to prevent further oxidation. Tantalum foil can also maintain good chemical stability in high temperatures or specific chemical environments.
Tantalum foil is a thin sheet of tantalum metal material, typically ranging in thickness from 0.001 millimeters to 0.5 millimeters.
With a melting point of up to 2996 ℃, it can maintain stable performance in high temperature environments and can be used to manufacture high-temperature resistant components. The density is about 16.6g/cm ³, with high strength and good impact resistance. The coefficient of thermal expansion is very small, only expanding by 6.6 parts per million for every one degree Celsius increase. It can maintain its original shape and characteristics in high temperature and high pressure environments, reducing the influence of thermal stress. It has strong resistance to acids, bases, and chlorides, and does not work on alkaline solutions, chlorine gas, bromine water, dilute sulfuric acid, and many other chemicals at room temperature. It can be used to manufacture corrosion-resistant equipment. It can form a dense oxide film in the air, further improving its corrosion resistance and stability. Tantalum foil is easy to process into thin sheets or fine wires, has good cold working performance, and can be made into various shapes and sizes of products through processes such as rolling and stamping. Although tantalum has relatively low hardness, tantalum foil has high strength and toughness, and can withstand certain external forces and deformations without breaking.
Ultra thin conductive layers or barrier layers can be prepared in chip manufacturing, and can also be used to manufacture high-k dielectric electrodes in DRAM to improve capacitance performance. It is an ideal choice for electrode materials in multi-layer ceramic capacitors. In tantalum electrolytic capacitors, a dielectric layer is generated through anodizing, achieving high capacitance density and low leakage current. It is suitable for high-voltage and high-frequency scenarios such as 5G base stations and vehicle electronics. Due to its good biocompatibility and corrosion resistance, it can be used to manufacture orthopedic bone nails, bone plates, cardiovascular stents, etc. The porous tantalum foil on the surface can also promote tissue growth; In terms of dental implants, there is no rejection reaction with human tissues. Can be used as cladding material or cooling pipeline in nuclear reactors, with high temperature resistance and radiation resistance characteristics; It can also be used as a shielding layer for nuclear waste containers.
