Product definition
Sputtering target is one of the main materials for preparing thin films by sputtering. Sputtering process is one of the main technologies for preparing electronic thin films. It uses ions generated by ion source to form high-speed ion beam after accelerated aggregation in high vacuum, bombarding the solid surface. The ions and atoms on the solid surface exchange kinetic energy, causing the atoms on the solid surface to leave the solid and deposit on the substrate surface. The bombarded solid is the raw material for depositing thin films by sputtering, which is called sputtering target.
Structurally, the target is mainly composed of "target blank" and "back plate". Among them, the target blank is the target material bombarded by high-speed ion beam, which belongs to the core part of sputtering target, involving high-purity metal and grain orientation regulation. The back plate plays the main role of fixing the sputtering target, involving welding process. Due to the low strength of high-purity metal, the sputtering target needs to complete the sputtering process in a dedicated machine. The inside of the machine is a high-voltage, high-vacuum environment, so the back plate also needs to have good electrical and thermal conductivity.
Product classification
Shape: It can be divided into long targets, square targets, round targets and tube targets. Among them, the most common targets are square targets and round targets, which are solid targets. At present, in order to improve the utilization rate of target materials, hollow cylindrical sputtering targets that can rotate around fixed bar magnet components are being promoted at home and abroad. Since the target surface of this type of target can be evenly etched at 360°, the utilization rate can be increased from the usual 20% to 30% to 75% to 80%.
Materials: Targets are classified into metal targets (pure tantalum, niobium, vanadium, hafnium, titanium, tungsten, molybdenum, etc.), alloy targets (tantalum-niobium alloy, niobium-tungsten alloy, niobium-zirconium alloy, C-103 niobium alloy, niobium 521 alloy, niobium-titanium alloy, nickel-titanium alloy, nickel-cobalt alloy, etc.), and ceramic compound targets (oxides, silicides, carbides, sulfides, etc.).
Industry classification
1) Display panel target industry
Depending on the different processes, FPD industry targets can also be roughly divided into sputtering targets and evaporation targets. Among them, sputtering targets are mainly Cu, Al, Mo and IGZO. Target materials used for evaporation are generally composed of two metals: Ag and Mg.
Application Classification: Mainstream display panels are divided into LCD and OLED. Thin-film transistor liquid crystal displays (TFT-LCDs) offer advantages such as thinness, low power consumption, and low cost. Currently, TFT-LCDs account for over 80% of the display panel market share. These display panels are composed of a large array of liquid crystal display cells (for example, a 4K resolution screen contains over 8 million cells), each of which is controlled and driven by a separate thin-film transistor (TFT).
The rapidly developing OLED panel industry has also seen a significant increase in demand for target materials. The typical OLED structure involves depositing a layer of light-emitting material tens of nanometers thick on indium tin oxide (ITO) glass. The ITO transparent electrode serves as the device's anode, while molybdenum or an alloy serves as the cathode.
2) Photovoltaic Target Industry
Target materials are primarily used in heterojunction and cadmium telluride batteries. ITO targets are core materials for depositing the transparent conductive layer in heterojunction solar cell production. Cadmium telluride, cadmium zinc telluride, and cadmium selenide are key consumables in the production of thin-film solar cells.
Applications: Targets used in photovoltaic cells form the back electrode. The back electrode of thin-film solar cells formed by sputtering targets has three primary purposes: first, it serves as the negative electrode for each individual cell; second, it provides a conductive path connecting the cells in series; and third, it increases the solar cell's light reflectivity. Currently, sputtering targets for thin-film solar cells are primarily square plates, with purity requirements generally exceeding 99.99% (4N). Commonly used sputtering targets for thin-film cells include aluminum, copper, molybdenum, and chromium, as well as ITO and AZO (aluminum zinc oxide). HIT cells primarily use ITO targets for their transparent conductive films. Aluminum and copper targets are primarily used for the conductive layer, molybdenum and chromium targets for the barrier layer, and ITO and AZO targets for the transparent conductive layer.
3) Semiconductor target industry
The semiconductor chip industry is one of the main application areas of metal sputtering targets. It is also the field with the highest requirements for the composition, structure and performance of target materials. The target purity requirement is usually 99.9995% (5N5) or even 99.9999% (6N). The role of metal sputtering targets for semiconductor chips is to make metal wires on the chip to transmit information.
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Wenquan village Industrial Zone, Gaoxin Development Zone, Baoji City, Shaanxi Province, China
