Nickel Vanadium Sputtering Target

Preparation process of Nickel Vanadium Sputtering Target
Metallographic inspection, vacuum induction melting, chemical analysis, forging, rolling, annealing, machining, dimensional inspection, cleaning, final inspection, and packaging are some of the steps in the preparation of a material.

Pure gold is typically used as an interconnect metal in the fabrication of integrated circuits, and it is deposited on a silicon wafer. However, gold will diffuse into the silicon wafer and form a high-resistance compound called AuSi, which will significantly reduce the current density in the wiring and lead to the failure of the entire wiring system.
Therefore, it is suggested that an adhesive layer be added in between silicon wafers and the gold thin sheet. A barrier layer is required to prevent diffusion between the gold conductive layer and nickel adhesive layer since the adhesive layer is typically composed of pure nickel but also experiences diffusion between the nickel layer and the gold conductive layer.、

Vanadium is selected to deposit barrier layers due to its high melting point and high current density, so nickel, vanadium, and gold sputtering targets are all used in the production of integrated circuits.
The benefits of both nickel and vanadium are combined in Nickel Vanadium Sputtering Target with 7% vanadium, allowing for the simultaneous formation of an adhesive layer and a barrier layer. The non-magnetic nature of NiV metal makes it ideal for magnetron sputtering. It is increasingly taking the place of pure nickel sputtering targets in the electronics information industry.

The most significant advantages of the high purity Nickel Vanadium Sputtering Target we created are the exceptional electrical conductivity of your films and the reduced particle formation during the PVD process. 

Additionally, we can create targets made from different nickel alloys, including NiAl, NiCo, NiCu, NiCr, NiW, NiCrSi, and NiCrAl, in accordance with your specific compositional, dimensional, and particle size needs.
 

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