Tantalum Targets for Semiconductors

In the semiconductor industry, tantalum metal (Ta) is currently mainly used as a target material for coating and forming barrier layers by means of physical vapor deposition (PVD). With the rapid development of science and technology, the development of the semiconductor industry is the core of the entire high-tech industry, is a measure of a country's level of science and technology and innovation capacity of the high point, so some countries attach great importance of, it is also the most important technology blockade; the current frontier of semiconductor technology are  the very large-scale integrated circuit manufacturing technology. The semiconductor chip industry is one of the main application areas of metal sputtering targets and is also the field with the highest requirements for the composition, organization, and performance of semiconductor tantalum targets. Specifically, the production process of semiconductor chips can be divided into three major segments: wafer manufacturing, wafer manufacturing, and chip packaging, of which, both wafer manufacturing and chip packaging require metal sputtering targets.

The role of metal sputtering targets for semiconductor chips is to make metal wires for information transmission on the chip. Specific sputtering process: first of all, the use of high-speed ion flow, in high vacuum conditions, respectively, to bombard the surface of different types of metal sputtering targets, so that the surface of the various targets deposited layers by layer of atoms on the surface of the semiconductor chip, and then through a special processing process, the deposited metal film on the surface of the chip etched into nano-level metal wire, the chip inside hundreds of millions of micro-transistors connected to each other The chip is connected to hundreds of millions of micro-transistors inside the chip, thus playing the role of signal transmission.

The main types of metal sputtering targets used in the semiconductor chip industry include copper, tantalum, aluminum, titanium, cobalt, and tungsten high-purity sputtering targets, as well as nickel-platinum, tungsten-titanium and other alloys of sputtering targets. Aluminum and copper are the mainstream processes for semiconductor production. Chip production of the conductive layer of both aluminum and copper wire process, generally speaking, 110nm wafer technology node above the use of aluminum wire, usually using titanium material as a barrier layer film material; 110nm wafer technology node below the use of copper wire, usually using tantalum material as a barrier layer of copper wire. In the application scenario of the chip, both the use of copper and tantalum materials and other advanced processes to achieve lower power consumption, increase computing speed, and other effects, but also the need to use aluminum and titanium materials above the 110nm node process to ensure reliability and interference resistance and other performance.

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