Nickel Titanium Sputtering Target

Nickel titanium (NiTi) alloy sputtering target Description

The brilliant silver alloy sputtering target and Nickel titanium sputtering target both have purity levels of over 99.9%, melting points of 1310°C, and densities of 6.45 g/cm3. Superelasticity or pseudoelasticity as well as form memory are features of this alloy. This indicates that this special metal alloy exhibits excellent elasticity under pressure and can recall its initial shape. The most distinctive characteristics of this alloy are its shape recall and extreme elasticity. When heated above its transformation temperature, the metal can "remember" and maintain its initial shape thanks to its shape memory properties. The crystal structures of nickel and titanium vary, which is the cause. Incredibly elastic, between 10 and 30 times more elastic than any regular metal, is also demonstrated by this pseudo-elastic metal.

Nickel Titanium Sputtering Target Properties (Theoretical)

Nitinol sputtering target applications

Shape memory alloy is extensively used in many industries, including machinery, building, aerospace, automobiles, and medical treatment because it has the benefits of super elasticity, high damping, wear resistance, and corrosion resistance in addition to its special shape memory function.

High purity Nickel Titanium Sputtering Targets with the greatest possible density are a specialty of Baoji Yusheng Metal. For use in semiconductor, chemical vapor deposition (CVD), physical vapor deposition (PVD), display, and optical applications, metallic sputtering targets with the highest purity (99.99%) and smallest typical grain sizes are available. With planar target dimensions and configurations up to 820 mm, our industry-standard sputtering targets for thin film are available as monoblock or bonded products. They feature hole drill locations, threading, beveling, grooves, and backing that are designed to work with both traditional sputtering devices and more recent process equipment.

We provide targets in all configurations and shapes, including circular, rectangular, annular, oval, "dog-bone," rotatable (rotary), multi-tiled, and others in standard, custom, and study sized dimensions, which are all compatible with all standard guns. The most effective methodologies, such as X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma, are used to examine all targets. (ICP). "Sputtering" is the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment,enabling the thin layer deposition of a sputtering metallic or oxide material of extremely high purity onto another solid substrate. Crystallization, solid state, and other extremely high purification processes like sublimation are used to produce materials.

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