Tantalum Sputtering Target

Tantalum sputtering target sputterin description
Tantalum sputtering targets have the same properties as their raw materials. Tantalum is one of the rare, hard, blue-grey, highly corrosion-resistant refractory metals. The melting point of tantalum is 2980℃ and the density is 16.68g/cm3. Tantalum has a series of excellent properties such as high melting point, low vapor pressure, good cold working performance, high chemical stability, strong resistance to liquid metal corrosion, and large dielectric constant of surface oxide film. It has important applications in high-tech fields such as electronics, metallurgy, steel, chemical industry, cemented carbide, atomic energy, superconducting technology, automotive electronics, aerospace, medical and health care, and scientific research.

 

Performance requirements of tantalum sputtering targets
The purity of tantalum targets is divided into three levels: 99.95% (3N5), 99.99% (4N), and 99.995% (4N5), and the specific individual impurity content should meet the user's requirements. After precision machining, the tantalum target has a good surface roughness and the surface should be clean and bright. During the pressure processing process, the internal structure of the tantalum target is easy to stratify. In addition, pores are also easy to form inside the tantalum ingot.

Qualified tantalum targets should not have defects such as internal organizational stratification and pores; their grain size should meet the requirements in Table 9-24; their hardness should meet the requirements of 60HV~110HV. Tantalum targets can be welded to the back plate by brazing or diffusion welding, and the welding quality should meet the requirements in Table 9-25. The diameter of tantalum targets for semiconductor chips is generally 200~460mm and the thickness is 6~10mm.

Chemical Composition

Element	R05200 (%,Max)	R05400 (%,Max)
C	0.01	0.01
O	0.015	0.03
N	0.01	0.01
H	0.0015	0.0015
Fe	0.01	0.01
Mo	0.02	0.02
Nb	0.1	0.1
Ni	0.01	0.01
Si	0.005	0.005
Ti	0.01	0.01
W	0.05	0.05

Yusheng Metal Products

Baoji Yusheng Metal Technology Co., Ltd. is located in the High-tech Development Zone of Baoji City, Shaanxi Province. The company's main products are: tantalum, niobium, vanadium, tungsten, molybdenum, titanium, zirconium, nickel, cobalt, indium, hafnium, tin, chromium and their alloys Conventional processing profiles such as plates, strips, foils, rods, wires, and tubes, as well as boats, crucibles, sputtering targets, coating targets, machined parts, high-temperature furnace heat shields, heating elements, furnace bodies (heating furnaces, Annealing furnace), corrosion-resistant equipment and other deep-processed products.

Yusheng Metal Equipment

We have 350KW electron beam bombardment furnace, 2000T hydraulic press.1700mm vacuum annealing furnace, one 42KW and two 15KW fine forging machines, 14-roll fine foil rolling machineLDD120,LDD-40, LDD-15, LDD-8 double line pipe roling machine,2-roll 500T open bilet mil, 4-roll cold roling machine.6-roll cold rolling machine, 15KW double-sided drawing machine, cylindrical grinding machine, skinning machine, surfacegrinding machine and a series of other equipment.

 

Tantalum Sputtering Target Applications

• Used in laboratory equipment.
• Used as a substitute for platinum.
• Used in the metallurgical, machinery processing, glass, and ceramic sectors; used in the production of superalloys and electron beam melting.
• Employed as a superalloy addition in alloys based on nickel.
• Used as sputtering targets in thin-film transistor liquid crystal displays and integrated circuits (TFT-LCD).

 

 

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